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IPA Mist Direct Replacement Drying Device 'IMD IIID'

Utilizing the Marangoni effect! Developed for the drying of thin wafers in power device manufacturing.

When using our conventional product "IMD III" for drying thin wafers, a problem arose where adjacent wafers came into contact when separating the wafer from the carrier, leading to inadequate drying. The "IMD IIID" holds the upper part of the wafer immediately after it emerges from the pure water surface, following the start of the drying process with pure water withdrawal. By subsequently separating the wafer from the carrier, it prevents contact between wafers, providing drying capabilities equivalent to carrierless drying. 【Features】 ■ Watermark-free drying ■ Marangoni drying using pure water withdrawal method ■ Drying of thin wafers, which is difficult with conventional drying methods ■ Reduction in IPA consumption (10-20cc/1 batch) ■ Capable of drying 3” to 8” wafers *For more details, please refer to the PDF document or feel free to contact us.

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